Solder paste for reflow and vapor phase soldering
F3+ is a halide-free, no-clean solder paste formulation with REL0 classification that can be combined with many lead-free alloys. The standard alloy SAC305 is especially suitable for the reflow process. For higher requirements calling for higher silver content, S9
Packaging and storage
| Jar | Public domain [g] | 500 |
|---|---|---|
| Small cartridge | High-density polyethylene [g] | 650 |
| Large cartridge | High-density polyethylene [g] | 1300 |
| Cassettes | [g] | 800 |
| Shelf life (months) | ||
| Storage conditions | 4 – 10°C | 6 |
Classification
| DIN-EN-29454-1: 1994 | 1.2.3.C | |
|---|---|---|
| IPC-J-STD-004-A: 2004 | REL0 | |
| IPC-J-STD-005: 1995 (powder) | T3/T4 | |
| Particle size | [µm] | 25-45/20-38 |
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Pricing, lead time and integration details for F3+
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